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 APC308
Rail to Rail Output CMOS Operating Amplifier
Features
* * * * * * * *
Operating Voltage Single Supply Low Input current Rail to Rail Output Swing Push-Pull Output Driving High Output Current Drive Bandwidth:7MHz Wide Temperature Range Available in 8 pin SOP ,DIP , TSSOP or MSOP Package 310mA 3V to 6V 2pA
Applications
* * *
Amplifiers Filters Analog circuit
Gereral Description
The APC308 consists of two independent, high gain, CMOS operating amplifier, combining rail to rail output range with large output current. It provides a low input bias current 2pA. The output swing of the amplifier, guaranteed for loads down to 1k and output current to an 10 load from a 5V power supply. APC308 designed to operating at 3V is especially well-suited for low voltage application.
Ordering Information
)2+!&
Handling Code Temp. Range Package Code Package Code J : PDIP - 8 O : TSSO P - 8 Tem p. Range I : - 40 to 85 C Handling Code TU : Tube
K : SO P - 8 X : M SO P-8
TR : Tape & Reel
Block Diagram
O ut 1 Inverting Input 1 N on-inv erting Input 1 V - &
V ,, O ut 2 Inverting Input 2 N on-inv erting Input 2
%
-+
! "
+$ #
APC308
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001 1 www.anpec.com.tw
APC308
Absolute Maximum Ratings
Symbol VDD TSC(O) TA TJ TSTG TS VESD Parameter Supply Voltage Output Short-circuit duration, at TA=25C, PTOT=1W Operating Ambient Temperature range Maximum Junction Temperature Storage Temperature Range Soldering Temperature, 10 seconds Electrostatic Discharge Rating 7 20 -40 to 85 150 -65 to +150 260 -3000 to 3000*1 Unit V S C C C C V
Note : *1. Human body model : C=100pF , R=1500 , 3 positive pulses plus 3 negative pulses
Thermal Characteristics
Symbol RTHJA Parameter Thermal Resistance from Junction to Ambient in Free Air DIP-8 SO-8 TSSOP MSOP 109 180 220 220 K/W K/W K/W K/W Value Unit
Electrical Characteristics
VDD=5V , TA=25C (unless otherwise noted)
Symbol Vos Ibias Vicm RIN Vo Voh Vol lout Parameter Input Offset Voltage Input Bias Current Input Common Mode Voltage Range Input Resistance Output Voltage Swing Output Voltage High Output Voltage Low RL=2k RL=10k, -25Cwww.anpec.com.tw
Output Current Source Output Current Sink CMRR Common Mode Rejection Ratio
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
2
APC308
Electrical Characteristics Cont.
VDD=5V , TA=25C (unless otherwise noted)
Symbol Parameter Condition Vrr=100mVpp, fin=100HZ,RL=2k Min. Typ. -50 85 7 5.6 2.0 2.5 Max. Unit dB dB MHz 4 5 V/s mA mA
PSRR Supply Voltage Rejection Ratio Av GBW SR Icc Large Signal Voltage Gain Gain Bandwidth Product Slew Rate Supply Current
-25CCopyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
3
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APC308
Typical Characteristics
Supply Current vs Supply Voltage No Load
4 3 .5
2 .0 1 .8
Supply Current vs Temperature VDD=5V
Supply Current (mA)
3 2 .5 2 1 .5 1 0 .5 0 0 1 2 3 4 5 6 7
Supply Current (mA)
1 .6 1 .4 1 .2 1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 -2 5 0 25 50 75
Supply voltage(V)
Temperature(C)
Input Offset Voltage vs Temperature VDD=5V
7 6 5 6 5
Input Common Mode Voltage vs Supply Voltage
VOS (mV)
4 3 2 1 0 -2 5 0 25 50 75
VICM (V)
4
3
2
1
0 0 1 2 3 4 5 6 7
Temperature(C)
Supply Voltage(V)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
4
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APC308
Typical Characteristics
Output Swing vs Supply Voltage RL=2k
8 7
6
Output Swing vs Temperature VDD=5V, RL=2k
5
Output Swing (V)
Output Swing (V)
0 1 2 3 4 5 6 7
6 5 4 3 2 1 0
4
3
2
1
0 -2 5 0 25 50 75
Supply Voltage (V)
Temperature(C)
Output Current vs Output Swing VDD=5V
1000
Output Swing vs Load Resistance VDD=5V
6 5
Output Swing (mA)
100
Output Swing (V)
4
10
3
2
1
1
0 .1 0 1 2 3 4 5 6
0 10 100 1k 10k
Output Swing (V)
Load Resistance ()
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
5
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APC308
Typical Characteristics
Sink Current vs Output Voltage VDD=5V
500 450
Source Current vs Output Voltage VDD=5V
500 450
Source Current (mA)
0 0 .1 0 .2 0 .3 0 .4 0 .5 0 .6 0 .7 0 .8 0 .9 1
400
400 350 300 250 200 150 100 50 0 0 0 .1 0 .2 0 .3 0 .4 0 .5 0 .6 0 .7 0 .8 0 .9 1
Sink Current (mA)
350 300 250 200 150 100 50 0
Output Voltage Referred to Ground (V)
Output Voltage Referred to Vdd(V)
Large Signal Voltage Gain vs Frequency VDD=5V
+100 +90 +80 +70
Large Signal Frequency Response VDD=5V, RL=2k
6 5
Output Swing (V)
4
Av (dB)
+60 +50 +40 +30 +20 +10 +0 10 100 1k 10k 100k 1M 10M
3
2
1
0 10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
6
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APC308
Typical Characteristics
Large Signal Voltage Gain vs Supply Voltage
100 95 90
CMRR vs Frequency VDD=5V,RL=10k
+0 -10 -20
80 75 70 65 60 55 50 1 2 3 4 5
CMRR (dB)
85
-30 -40 -50 -60 -70 -80 -90
Av (dB)
-10 0
10
100
1k
10k
100k
Supply Voltage (V)
Frequency (Hz)
VDD=5V VRR=100mVpp/100Hz
+0 -10 -20
PSRR vs Frequency
Voltage Follower Pulse Response VDD=5V,RL=2k
9 8 5 4 3 2 1 0
Output Voltage (V)
7 6 5 4 3 2 1 0
-30 -40 -50 -60 -70 -80
-1 -2 -3 -4
10
100
1k
10k
100k
! " #
Frequency (Hz)
Time (s)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
7
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Input Voltage (V)
PSRR (dB)
APC308
Typical Characteristics
Voltage Follower Pulse Response VDD=5V,CL=270pF
0 .5 0 .4 0 .2 0 .1 0
Output Voltage (V)
0 .2 0 .1 0
-0 .1 -0 .2 -0 .3
-0 .1 -0 .2
- 004 - . .4 -0 .5
0
1
2
3
4
Time (s)
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
Input Voltage (V)
8
0 .3
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APC308
Packaging Information
PDIP-8 pin ( Reference JEDEC Registration MS-001)
D
E1 1
E
A L e2 e1 e3 A1
A2
1 E3
Dim A A1 A2 D e1 e2 e3 E E1 E3 L 1
Mi l l im et er s Mi n . 0. 3 8 2. 9 2 9. 0 2 2. 5 4BSC 0. 3 6 1. 1 4 7. 6 2 BSC 8. 2 6 6. 1 0 2. 9 2 0 7. 1 1 10 . 92 3. 8 1 15 0. 2 40 0. 1 15 0 0. 5 6 1. 7 8 0. 0 14 0. 0 45 Ma x . 5. 3 3 3. 6 8 10 . 16 Mi n . 0. 0 15 0. 1 15 0. 3 55
Inc he s Ma x . 0. 2 10 0. 1 45 0. 4 00 0. 1 00 BS C 0. 0 22 0. 0 70 0. 3 00 BSC 0. 3 25 0. 2 80 0. 4 30 0. 1 50 15
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
9
www.anpec.com.tw
APC308
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
E
H
e1 D
e2
A1
A
1 L
Inc he s
0.004max.
Dim A A1 D E H L e1 e2 1 0 Mi ll im et er s Mi n. 1. 3 5 0. 1 0 4. 8 0 3. 8 0 5. 8 0 0. 4 0 0. 3 3 1. 2 7BSC 8 0 Ma x . 1. 7 5 0. 2 5 5. 0 0 4. 0 0 6. 2 0 1. 2 7 0. 5 1 Mi n. 0. 0 53 0. 0 04 0. 1 89 0. 1 50 0. 2 28 0. 0 16 0. 0 13
0.015X45
Ma x . 0. 0 69 0. 0 10 0. 1 97 0. 1 57 0. 2 44 0. 0 50 0. 0 20 0. 5 0BSC 8
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
10
www.anpec.com.tw
APC308
Packaging Information
TSSOP
e 87
2x E/2 E1 E S ( 2) GAUGE PLANE
12
e/2
D
0.25 A2 A ( 3)
L (L1)
1
b
A1
Dim A A1 A2 b D e E E1 L L1 R R1 S 1 2 3
Min. 0.00 0.80 0.19 2.9 4.30 0.45 0.09 0.09 0.2 0
Millimeters
0.65 BSC 6.40 BSC 1.0 REF
Max. 1.2 0.15 1.05 0.30 3.1 4.50 0.75
Min. 0.000 0.031 0.007 0.114 0.169 0.018 0.004 0.004 0.008 0
Inches
0.026 BSC 0.252 BSC 0.039REF
Max. 0.047 0.006 0.041 0.012 0.122 0.177 0.030
12 REF 12 REF
8
12 REF 12 REF
8
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
11
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APC308
Packaging Information
MSOP
e1
E
E1
e1
L1 A1 A3 A2 L2
Dim A1 A2 A3 e e1 E E1 L1 L2
Min. 0.06 0.25 2.90 4.8 2.90
Millimeters 0.86 TYP 0.65 TYP
Max. 0.15 0.4 3.1 5.0 3.1
Min. 0.002 0.01 0.114 0.189 0.169
Inches 0.34 TYP 0.0256TYP
Max. 0.006 0.0126 0.124 0.197 0.177
0.25 REF 0.0375 REF
0.039REF 0.953 REF
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
12
www.anpec.com.tw
APC308
Physical Specifications
Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 2500 devices per reel
Reflow Condition
(IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature Peak temperature 183C Pre-heat temperature
Classification Reflow Profiles
Convection or IR/ Convection Average ramp-up rate(183C to Peak) 3C/second max. 120 seconds max Preheat temperature 125 25C) 60 150 seconds Temperature maintained above 183C 10 20 seconds Time within 5C of actual peak temperature Peak temperature range 220 +5/-0C or 235 +5/-0C Ramp-down rate 6 C /second max. 6 minutes max. Time 25C to peak temperature
Time
VPR 10 C /second max. 60 seconds 215-219C or 235 +5/-0C 10 C /second max.
Package Reflow Conditions
pkg. thickness 2.5mm and all bgas Convection 220 +5/-0 C VPR 215-219 C IR/Convection 220 +5/-0 C pkg. thickness < 2.5mm and pkg. volume 350 mm pkg. thickness < 2.5mm and pkg. volume < 350mm Convection 235 +5/-0 C VPR 235 +5/-0 C IR/Convection 235 +5/-0 C
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Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
13
APC308
Reliability test program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C , 5 SEC 1000 Hrs Bias @ 125 C 168 Hrs, 100 % RH , 121C -65C ~ 150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , IJH > 100mA
Carrier Tape & Reel Dimensions
t E Po P P1 D
W
F
Bo
Ao
D1 T2 J C
Ko
A
B
T1 Application SOP- 8 TSSOP- 8 Application SOP- 8 TSSOP- 8 A 330 1 330 1 F B 62 1.5 62 1.5 D C 12.75 +0.1 5 12.75 0.1 5 D1 J T1 W P E 12 + 0.3 2 0.2 8.0 0.1 1.75 0.1 - 0.1 12 + 0.3 2 0.2 8.0 0.1 1.75 0.1 - 0.1 Ao Bo Ko t 0.3 6.4 0.1 5.2 0.1 2.1 0.1 0.013 0.3 7.0 0.1 3.6 0.3 1.6 0.1 0.013 (mm)
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T2
2 + 0.5 12.4 + 0.2 2 + 0.5 12.4 + 0.2 Po P1
5.5 0.1 1.55 0.1 1.5+0.25 4.0 0.1 2.0 0.1 5.5 0. 1.5 + 0.1 1.5 + 0.1 4.0 0.1 2.0 0.1
14
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
APC308
Cover Tape Dimensions
Carrier Width Cover Tape Width 12 9.3
(mm)
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. A.1 - Oct., 2001
15
www.anpec.com.tw


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